All Tensor chipsets thus far and the upcoming Tensor G4 have been based mostly on Exynos chips and fabbed by Samsung. However Google has been engaged on an in-house design and can reportedly transfer away from Samsung’s foundries.
A buying and selling file gives the primary proof that the Tensor G5 can be fabbed by TSMC as an alternative. The G5 can be used within the Pixel 10 collection in late 2025, if all goes properly. This info was found by Android Authority, who created this helpful chart to elucidate all of the abbreviations:
That is the the place the knowledge comes from, transport particulars for G5 chips for testing. Word that A0 is the primary stepping, so it will likely be examined for points and never what can be in retail items (there’s not less than a yr till we get to that time). Additionally, discover the title Tessolve – the corporate describes itself as an “end-to-end solution provider, from chip design, test, & PCB engineering”.
The primary proof that the Tensor G5 can be fabbed by TSMC
Google has not moved away from Samsung utterly, the 16GB of RAM are manufactured by Samsung Electronics Co. (i.e. SEC). The Pixel 9 collection is meant to be the primary era to function a 16GB RAM possibility (collection 8 and earlier topped out at 12GB).
Why is the chipset tied so carefully with the RAM? That’s due to “InFO_PoP”, i.e. Built-in Fan-Out Package deal on Package deal, which is TSMC expertise for grafting the RAM on prime of the chipset:
InFO_PoP makes for thinner packaging (1.16mm on this case) and has improved electrical and thermal properties too.
The Tensor G4, coming later this yr, guarantees to higher warmth administration and energy effectivity than the G3. Whether or not or not that pans out, the G5 is a significant redesign, so the G4’s efficiency would possibly imply little or no for a way the G5 will do.
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